Merritronix Ltd IPO

Initial public offer of 47,00,000 equity shares of face value of Rs. 10/- each ("Equity Shares") of Merritronix Ltd (the "Company" or "Merritronix" or "Issuer") at an issue price of Rs. 149 per equity share (including a share premium of Rs. 139 per equity share) for cash, aggregating Rs. 70.03 Crores ("Public Issue") out of which 2,36,000 equity shares of face value of Rs. 10/- each, at an issue price of Rs. 149 per equity share for cash, aggregating Rs. 3.52 Crores will be reserved for subscription by the market maker to the issue (the "Market Maker Reservation Portion"). The public issue less market maker reservation portion i.e. Issue of 44,64,000 equity shares of face value of Rs. 10/- each, at an issue price of Rs. 149 per equity share for cash, aggregating Rs. 66.51 Crores is hereinafter referred to as the "Net Issue". The public issue and net issue will constitute 26.88% and 25.53% respectively of the post-issue paid-up equity share capital of the company. Price Band: Rs. 149/- per equity share of face value Rs. 10/- each. The floor price is 14.9 times of the face value of the equity shares. Bids can be made for a minimum of 2000 equity shares and in multiples of 1000 equity shares thereafter.

Merritronix Limited was incorporated on the October 14, 1988 as 'Merritronix Private Limited', a Private limited company with the Registrar of Companies, Andhra Pradesh. Subsequently, Company was converted into a Public limited company and the name of the Company was changed to 'Merritronix Limited' upon such conversion dated February 07, 2025 obtained from the Central Registration Centre. Merritronix is an an Electronics Systems Design and Manufacturing services (ESDM) company specializing in high-reliability, mission critical electronic assemblies and systems for defence, aerospace, telecommunications, Rapid Prototyping for design houses OEMs, Engineering services Companies and specialized industrial electronics. They are primarily engaged in electronic manufacturing services, encompassing component sourcing, printed circuit board (PCB) assembly, systems integration, testing, box-build solutions and delivery of finished electronic products - executed to the quality standards required by India's strategic defence and aerospace programmes. Manufacturing facility as on March 31, 2026 operate the installed capacity of 10,75,000 boards for SMT assembly, 6,00,000 boards for Through-Hole Technology (THT) assembly, and 4,20,000 units for product assembly/box build, aggregating to 20,95,000 production units per annum. A key part of the manufacturing process is Surface-Mount Technology (SMT), which involves assembling electronic components directly onto the surface of printed circuit boards (PCBs) using automated placement systems and controlled reflow processes. In 1993, Merritronix shifted its focus to the telecom industry, supplying telecommunication cable jointing kits for India's landline network expansion. In 2006, the Company expanded the operations into the defence and aerospace sectors. In 2007-08, it transitioned towards turnkey manufacturing, providing complete services. In 2012, it undertook a strategic diversification by venturing into turnkey electronics solutions, for assembling, integration and final testing of electronic products. In 2022, Company expanded into the Electronics Component Supply & Obsolescence Management. It began developing custom semiconductor solutions for defence applications including the replacement for obsolete Xilinx CPLDs and Airflow Sensors. The Company has invested in new-generation SMT equipment during FY2025-26, including the Panasonic NPM D3A pick-and-place line commissioned in January 2026. The Company has launched the IPO by issuing 47,00,000 equity shares of Rs 10 each through fresh issue on June 3, 2026.